To launch its first calls for innovative pilot lines, the Chips JU will make €1.67 billion in EU funding available. The calls are open to organisations that wish to establish pilot lines in Member States, typically research and technology organisations, calling for proposals on:

• Fully Depleted Silicon on Insulator, towards 7 nm: This transistor architecture is a European innovation and has distinct advantages for high-speed and energy-efficient applications. A roadmap towards 7 nm will provide a path towards the next generation of high-performance, low-power semiconductor devices.
• Leading-edge nodes below 2 nm: This pilot line will focus on developing cutting-edge technology for advanced semiconductors at the size of 2 nanometres and below, which will play essential roles in a variety of applications, from computing to communication devices, transport systems and critical infrastructure.
• Heterogeneous system integration and assembly: Heterogeneous integration is an increasingly attractive technology for innovation and increased performance. It refers to the use of advanced packaging technologies and novel techniques to combine semiconductor materials, circuits or components into one compact system.
• Wide Bandgap semiconductors: The focus will be on materials that allow electronic devices to operate at much higher voltage, frequency and temperature than standard silicon-based devices. Wide bandgap and ultra-wide bandgap semiconductors are necessary to develop highly efficient power, lighter weight, lower costs and radio-frequency electronics.