We’re excited to announce that registration is officially open for the EFECS – the European Forum for Electronic Components and Systems, taking place in Malta, on December 3–4
Year
JU Era
18
December
2024
Recap of EFECS 2024: Strengthening EU Competitiveness to connect with leaders and innovators driving
The European Forum for Electronic Components and Systems (EFECS) 2024, held on December 5-6, brought together more than 700 participants,
18
December
2024
APECS marks a milestone for the European semiconductor industry
The Pilot Line on Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) is ready to fly.
10
January
2025
Chips Joint Undertaking Adopts Amendment to Multiannual Work Programme 2023-2027
The Chips Joint Undertaking (Chips JU) has adopted an amendment to its Multiannual Work Programme (MAWP) for 2023-2027, introducing significant updates to its strategic initiatives for 2025.
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